methods & tools

Our equipment at the EMRL in Aachen and Jülich comprises a broad spectrum of facilities for the fabrication and characterization of electronic materials and devices. The emphasis is placed upon oxide deposition technologies ranging from laser MBE, atomic layer deposition by MOCVD, high pressure sputtering to chemical solution deposition (CSD). These facilities are complemented by integration technologies such as optical and nanoimprint lithography, various metallization techniques, plasma based and ion beam based dry etching, as well as scanning probe based manipulation and self-assembly methods. In addition, we are equipped with a large variety of tools for the characterisation of processes, structures, and electronic properties. In particular, we provide a large range of dedicated scanning probe tools in order to analyze specific properties with atomic resolution. Circuit design is utilized for the development of hybrid and integrated circuits which comprise of new electronic functions as well as advanced measurement systems. Furthermore, our competences include numerical simulation and modelling methods which aim at the quantitative description of the electronic phenomena and materials under study as well as the corresponding devices.
The EMRL is a founding member of the section Fundamentals of Future Information Technologies of the Jülich-Aachen Research Alliance (JARA-FIT) and, as such, in addition to our own equipment, we have access through our partner institutes in the alliance to almost every conceivable nano-fabrication and nano-characterisation technique.